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Table of Contents for the Digital Edition of PCB-Feb2012
Cover
Featured Content
Contents
Column — 7 Billion
Feature — Latest on Lead-Free Capable Materials
Video Interview — IPC: How Environmental Regs Affect your Business
Column — Advances in Copper Plating, Part A
Feature — Circuit Materials and High-Frequency Losses of PCBs
News — Top Ten Most-Read Flex007 Highlights This Month
Column — Let Your Feelings DAM Go: Be a Horrible Manager Like Steve Jobs
Feature — Thermal Management Substrates
Video Interview — Ventec Celebrates Five Years
Special Section — IPC APEX EXPO 2012 — Show Schedule
IPC APEX EXPO 2012 — Free Keynote Presentations
IPC APEX EXPO 2012 — Technical Conferences
IPC APEX EXPO 2012 — Standards Development Meetings
IPC APEX EXPO 2012 — Professional Development Courses
News — Most-Read MilAero007 News Highlights This Month
Article — Advanced Routing Technology — Depth Routing
Column — Case Study: PTH Voids
Feature — Conductive Anodic Filaments: The Role of Epoxy-Glass Adhesion
Column — A Cautionary Tale
Feature — DuPont Talks Development Trends and Highlights in PCB Materials Industry
News — Most-Read PCB Design007 News Highlights This Month
Column — Board-Level Simulation and the Design Process: Plan B — Post Layout Simulation
Feature — Overview: Technological Developments and the Materials Supply Chain in the PCB Industry
Short — Intercept Technology, Inc. to Release New User Interface Pantheon 7 at IPC APEX EXPO
Column — Rigid-flex Manufacturing Part II: Materials
Article — Flexible Circuit Solutions Continue to Evolve and Expand Their Range of Capability
News — Most-Read Supplier/New Product Highlights This Month
Video Interview — Productronica's Unsung Hero
Short — Taiyo America to Unveil Liquid Photoimagable Solder Mask at IPC APEX EXPO
News — Top Ten Most-Read News Highlights from PCB007 this Month
Column — It's Show Time!
Events Calendar
Advertiser Index and Masthead
PCB-Feb2012
Electronics
MATERIALS
FEBRUARY 2012
THE WAY I SEE IT
7 BILLION continues
7 BILLION continues
Latest on Lead-Free Capable Materials
“ Initially, most customers reflexively specify “best” materials
LATEST ON LEAD-FREE CAPABLE MATERIALS continues
Supplying the base for innovation
LATEST ON LEAD-FREE CAPABLE MATERIALS continues
LATEST ON LEAD-FREE CAPABLE MATERIALS continues
KARL’S TECH TALK
ADVANCES IN COPPER PLATING, PART A continues
ADVANCES IN COPPER PLATING, PART A continues
Circuit Materials and
Electrical losses for a PCB design become important when the circuit is no
CIRCUIT MATERIALS AND HIGH-FREQUENCY LOSSES OF PCBS continues
CIRCUIT MATERIALS AND HIGH-FREQUENCY LOSSES OF PCBS continues
CIRCUIT MATERIALS AND HIGH-FREQUENCY LOSSES OF PCBS continues
Top Ten Most-Read
SOLVING YOUR DAMPROBLEMS
LET YOUR FEELINGS DAM GO continues
LET YOUR FEELINGS DAM GO continues
Thermal
“
THERMAL MANAGEMENT SUBSTRATES continues
Your Single Source
THERMAL MANAGEMENT SUBSTRATES continues
THERMAL MANAGEMENT SUBSTRATES continues
THERMAL MANAGEMENT SUBSTRATES continues
The UK’s leading PCB equipment supplier
THERMAL MANAGEMENT SUBSTRATES continues
THERMAL MANAGEMENT SUBSTRATES continues
IPC APEX EXPO 2012 — Special Coverage Section
Tuesday, February 28
FREE Keynote Presentations
Technical Conferences
Technical Conferences — continues
Technical Conferences — continues
Professional Development Courses
Professional Development Courses — continues
Professional Development Courses — continues
Professional Development Courses — continues
Most-Read MilAero007
ADVANCED ROUTING TECHNOLOGY – DEPTH ROUTING
with increased complexity and smaller tolerances.
ADVANCED ROUTING TECHNOLOGY — DEPTH ROUTING continues
ADVANCED ROUTING TECHNOLOGY — DEPTH ROUTING continues
ADVANCED ROUTING TECHNOLOGY — DEPTH ROUTING continues
ADVANCED ROUTING TECHNOLOGY — DEPTH ROUTING continues
ADVANCED ROUTING TECHNOLOGY — DEPTH ROUTING continues
TROUBLE IN YOUR TANK
CASE STUDY: PTH VOIDS continues
CASE STUDY: PTH VOIDS continues
All glass fibers used in glass ply production
“
CONDUCTIVE ANODIC FILAMENTS: THE ROLE OF EPOXY-GLASS ADHESION continues
POINT OF VIEW
A CAUTIONARY TALE continues
Figure 1: DuPont’s CooLam
“
DUPONT TALKS DEVELOPMENT TRENDS AND HIGHLIGHTS IN PCB MATERIALS INDUSTRY continues
Most-Read PCBDesign007
BEYOND DESIGN
PLAN-B — POST LAYOUT SIMULATION continues
PLAN-B — POST LAYOUT SIMULATION continues
PLAN-B — POST LAYOUT SIMULATION continues
Why choose Fein-Line?
PLAN-B — POST LAYOUT SIMULATION continues
PLAN-B — POST LAYOUT SIMULATION continues
Overview: Technological Developments and
pitch ball grid arrays) in order to facilitate the
MATERIALS SUPPLY CHAIN IN THE PCB INDUSTRY continues
MATERIALS SUPPLY CHAIN IN THE PCB INDUSTRY continues
LEAN, MEAN PCB SPECIALIST
RIGID-FLEX MANUFACTURING PART II: MATERIALS continues
RIGID-FLEX MANUFACTURING PART II: MATERIALS continues
Flexible Circuit Solutions Continue to Evolve
ing) products. Though invented in the 1960s,
Most-Read Supplier/New Product
Productronica’s Unsung Hero
TOP
e IPC Adjusts Roadmap
THE SALES CYCLE
“
EVENTS
PUBLISHER: BARRY MATTIES